CVE-2023-33063
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
This vulnerability is in the CISA Known Exploited Vulnerabilities catalog: attackers are using it. If you run Multiple Chipsets, fix it now.
CISA required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
US federal civilian agencies must remediate by Dec 26, 2023.
Patch status
Official fix available since
Apply the vendor's update to every affected system. Check the fixed-in versions below where known.
Basis: NVD patch reference
Description
Memory corruption in DSP Services during a remote call from HLOS to DSP.
Source: NIST National Vulnerability Database. Official vulnerability data, reproduced as published.
Affected products
| Product | Vendor | Source |
|---|---|---|
| Multiple Chipsets | Qualcomm | KEV |
Sources: KEV = CISA Known Exploited Vulnerabilities catalog. Version details have not been published yet.
Intelligence timeline
Developments from the last 30 days, newest first.
- CVSS scoredUpdateKEV
CVE-2023-33063 scored CVSS 7.8: Qualcomm Multiple Chipsets, Qualcomm Multiple Chipsets Use-After-Free Vulnerability
CISA lists this as exploited in the wild. Unpatched Multiple Chipsets systems are exposed to active attacks now.
Basis: NIST National Vulnerability Database
- Patch releasedUpdateKEV
Patch released for CVE-2023-33063: Qualcomm Multiple Chipsets, Qualcomm Multiple Chipsets Use-After-Free Vulnerability
An official fix is now available for Qualcomm Multiple Chipsets. This vulnerability is being exploited, so apply it promptly.
Basis: NVD patch reference
1 earlier event is available with a subscription. See plans.
Coverage
We have not published a story about this vulnerability yet.